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Page last modified 18:29, 25 Nov 2011 by toquim

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Version as of 09:13, 18 Dec 2025

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  • Tracks width and differential pairs spacing in order to achieve a thinner PCB;
  • Galvanic isolation tracks spacing;
  • J2 Footprint;
  • J59 Footprint;
  • Keepout keying K1;
  • Test points silk screen;
  • References backannotation;
  • Solder mask U51, U55 and U58;
  • Terminations position;
  • Decoupling capacitors position;
  • FTM connector’s replacement;
  • Front panel adjustments;
  • RTM mechanical issues;
  • Rear panel adjustments;
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